High-Speed Durable Multi-Axis Speed Controller Module for Electric Skateboards, Drones & RC Vehicles - Stable Performance & Scratch Prevention for Smooth Riding Experience

Feature:1. PCB adopts immersion gold thickening process, designed with 6‑layer PCB LAYou, each layer of copper foil thickness is 3OZ.2. Immersion gold sunroof in key parts of PCB increases heat dissipation and over‑current treatment process, which makes the overall effect better.3. A spark‑proof switch function is added to the front of the power supply to protect the power contact and the electronic components of the integrated circuit to avoid sparks that may cause explosion.4. Use MIC5219‑3.MY instead of LM3671 chip to increase the current from 600MA to 500MA x 2=1000A to obtain a more stable current output.5. A waterproof aviation aluminum alloy shell is added, the thermal silica gel is matched with the heat sink to enhance the heat dissipation performance of the ESC. The shell surface is anodized to prevent scratches.6. In order to better deal with the high current GND and the mutual interference between the GND of the MCU circuit and the GND of the NRF circuit, we added three Ω resistors to better achieve the filtering effect.7. Added two IN5819 diode rectifiers to achieve 3.3V short circuit protection, replace C9 2.2uF on the capacitor with 10uF, and add a 4.7uF filter capacitor.Specification:Item Type: Electric Speed ControllerMaterial: Waterproof aviation aluminum alloy + thermal silicaModel: Single drive v6 with shellThe firmware version of FSESC6.6 is VESC_default_no_hw_limits, which is compatible with for Benjamin VESC TOOL and can be used for models, multi-axis aircraft, electric vehicles, electric skateboards, smart cars, robots and simple industrial position control.Specification: Hardware: V 6.6Firmware: Latest firmware versionVoltage: 8V-60V (3S

A waterproof aviation aluminum alloy shell is added, the thermal silica gel is matched with the heat sink to enhance the heat dissipation performance of the ESC. The shell surface is anodized to prevent scratches.

A waterproof aviation aluminum alloy shell is added, the thermal silica gel is matched with the heat sink to enhance the heat dissipation performance of the ESC. The shell surface is anodized to prevent scratches.

A waterproof aviation aluminum alloy shell is added, the thermal silica gel is matched with the heat sink to enhance the heat dissipation performance of the ESC. The shell surface is anodized to prevent scratches.

A spark‑proof switch function is added to the front of the power supply to protect the power contact and the electronic components of the integrated circuit to avoid sparks that may cause explosion.

PCB adopts immersion gold thickening process, designed with 6‑layer PCB LAYou, each layer of copper foil thickness is 3OZ.

Use MIC5219‑3.MY instead of LM3671 chip to increase the current from 600MA to 500MA x 2=1000A to obtain a more stable current output.

Immersion gold sunroof in key parts of PCB increases heat dissipation and over‑current treatment process, which makes the overall effect better.